| Detailed Etching: PMP can be used to micromachine detailed patterns and markings with a resolution up to 0.002" (50 µm). |
| Deep Etching: PMP can be used for relatively deep etch on lower density material. |
| Hole Drilling: PMP is well suited for creating thru-holes and patterns in thin materials. Blind holes are also possible. Fragile workpieces will not experience the chips or breakage associated with other machining methods. |
| Large Area Removal: PMP provides the ability to quickly remove significant material on a large workpiece. Work area or work piece size limitations inherent to CNC and ultrasonic machining are not an issue with Photoresist Machining. |
| Marking/Part Identification: Difficult to mark workpieces can be individually and indelibly identified using PMP. |
| Surface Texturing/Finishing: PMP can be used to abrade most surfaces to create unique surface patterns, prepare the surface for a future coating process and/or produce a variety of surface finishes. |
| Coating Removal: PMP offers the ability to selectively remove coatings generating detailed and complex patterns as required. |
