Photo-Machining Capabilities include:

• Detailed patterns and shapes such as holes, channels, surface pads or mesas, blind holes and/or markings with high accuracy and repeatability to within 25µm part to part.
• Positional accuracy +/-10µm over large areas (300+mm diameters)
• Feature size (X & Y) accuracy within a part to within 5µm.
• Relatively deep etching on lower density materials (glass, silicon, etc.).
• Handling of very thin substrates down to 200µm, including glass wafers.
• Simplicity of producing multiple patterns on a part at the same time.
• Producing patterns (different ones) on BOTH sides of the workpiece.
• Removal of large amounts of material quickly (i.e. large open areas and around posts/mesas).
• Drilling holes in thin wafer materials (excellent for drilling hole array patterns quickly)
• Individually & indelibly engrave individual hard-to-mark parts.
• Texturing to create or prepare surfaces for subsequent coatings or to promote adhesive bonds.
• Selective coating removal (micron thin metals, oxides and others) from surfaces for a variety of applications.
• Large pattern design capability (up to 500mm) that may otherwise be compromised or impractical with other machining methods.
• Flexibility to frequently change pattern designs at little cost and time.

While many of these operations can be accomplished with ultrasonic machining, rotary tooling/end milling (Handheld or CNC), EDM, lasers and grinding equipment, Photo-Machining is often much faster—not just in producing the part, but also in the time it takes for tooling preparation and setup. Properties

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