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PHOTO-MACHINING: CAPABILITIES

Brittle materials, like those used in ceramics machining, are notoriously difficult to machine because of their high level of hardness and propensity to chip or crack. Additionally, machining these materials can cause costly cutting tool wear.

Typical machining needs that can be met with this process include:

  • Creating detailed patterns and shapes such as channels, surface pads, blind via holes and/or markings with high accuracy and repeatability.
  • Relatively deep etching on lower density materials.
  • Removal of large amounts of material quickly.
  • Drilling holes in thin wafer materials (excellent for drilling hole array patterns quickly)
  • Individually & indelibly engrave individual hard-to-mark parts.
  • Texturing to create or prepare surfaces for subsequent coatings or to promote adhesive bonds.
  • Selective coating removal from surfaces for a variety of applications.
  • Expanding the pattern design capability that may otherwise be compromised or impractical with other machining methods.
 

While these operations can be accomplished with ultrasonic machining, rotary tooling/end milling (Handheld or CNC), EDM, lasers and grinding equipment, PMP is often much faster—not just in producing the part, but also in the time it takes for setup.

PMP Limitations
There are limits to what PMP can do.

Although metals and plastics can be surface engraved or marked, they cannot be machined deeply with PMP due to their inherently ductile nature. PMP does work well, however, to selectively remove thin layers (<.005”) of these materials such as copper-clad substrates or metal encapsulated ceramics.

Etching produces a tapered side wall as the etch deepens due to the build-up of abrasive in the etched cavity. This build-up causes the sides of the feature to etch more slowly than the center leaving the bottom of the etch area with a slight radius. NOTE: For through-holes in some materials, etching can be done from both sides to help straighten sidewalls. In thicker materials, this may produce an hour-glass effect which may be beneficial in certain applications.

Precision etch depth control will require an automated etching system, although manual etching will typically yield tolerances of +/- 0.002".

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