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| IKONICS® INDUSTRIAL PHOTO-MACHINING |
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IKONICS Industrial offers an alternative, cost effective precision "machining" service to selectively pattern or remove materials from high density, hard/brittle surfaces for applications like hole drilling in silicon, sapphire or borosilicate wafers; mesas for wafer chucks in silicon carbide or other ceramics; blind via holes and micro-channels.
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WHY PHOTO-MACHINING?
Brittle materials such as Glass, Ceramics, Sapphire, etc. are notoriously difficult to machine using conventional equipment and have a high propensity to chip or crack. Tool wear can be excessive causing dimensional changes, thermal stresses and shape changes when using CNC, ultrasonic and laser machining resulting in loss of dimensional control and high costs. Alternatively, Photo-Machining combines the precision of photo-lithography with automated powder blasting to impart a controlled, dry, very low stress, and fast precision removal of the desired material. |
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