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| IKONICS®
INDUSTRIAL PHOTO MACHINING |
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IKONICS
Industrial offers an alternative, cost effective precision machining
service to selectively pattern or remove materials from high
density, hard/brittle surfaces for applications like hole drilling
in silicon, sapphire or borosilicate wafers; mesas for wafer
chucks in silicon carbide or other ceramics; blind via holes
and micro-channels.
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PHOTO
MACHINING CAPABILITIES
- Accuracy to within microns (X, Y & Z position)
- Precision patterns, channels, holes
- Blind via holes, grooves
- Large area & selective material removal
- Selective materials/coatings removal
- Surface texturing
- Large substrate processing to 500mm
- Low cost, quick turnaround (often < 2wks)
- Flexible design changes
- Prototyping and Production
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More information
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PHOTO
MACHINABLE MATERIALS
- Alumina – all densities
- Aluminum Nitride
- Boron Carbide or Nitride
- Carbon fiber
- Ceramic & KEVLAR Composites
- Ferrite
- Glass, Quartz, Borosilicate
- Graphite
- Mullite, Steatite, Titanium Nitride
- Sapphire
- Silicon Carbide, Silicon Nitride
- Zirconia
- Other
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INDUSTRY APPLICATIONS
- MEMS sensors, wafer drilling
- Silicon Carbide /Ceramic Wafer chucks
- Silicon Wafer Carriers
- High precision ceramics and electronics for Aerospace & Defense
- Microfluidics / Fuel Cells
- Photovoltaic
- Ceramic Heater Plates
- Optics (glass parts patterns & holes)
- LCD Displays
- Other
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More information
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WHY
PHOTO MACHINING?
Brittle materials such as Glass, Ceramics, Sapphire, etc.
are notoriously difficult to machine using conventional equipment
and have a high propensity to chip or crack. Tool wear can
be excessive causing dimensional changes, thermal stresses
and shape changes when using CNC, ultrasonic and laser machining
resulting in loss of dimensional control and high costs. Alternatively,
Photo Machining combines the precision of photo-lithography
with automated powder blasting to impart a controlled, dry,
very low stress, and fast precision removal of the desired
material.
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