| PHOTO-MACHINING: INTRODUCTION & OVERVIEW |
Machining into high density alumina, silicon carbide, silicon nitride, and fragile materials like borofloat glass and silicon wafers can be difficult or often impossible with conventional machining technologies. More importantly, they can be expensive, labor intensive, time consuming and require large up-front tooling costs.IKONICS Industrial utilizes a Photo-Machining technology which overcomes many of these shortcomings, allowing customers to realize enhanced business results in their respective markets. Photo-Machining combines the precision of a patent pending photo resist system developed by IKONICS, and powder blasting to provide our customers with workable, cost effective solutions, while delivering a quality made product and rapid turnaround.
A partial list of materials suitable for Photo-Machining include:
- Alumina
- Alumina Silicate
- Aluminum Nitride
- Anodized Aluminum
- Borofloat Glass
- Carbon Fiber
- Ceramic Composites
- Graphite
- Mullite
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- Quartz
- Silicon Carbide
- Silicon Nitride
- Steatite
- Titanium Nitride
- Variety of Plated/Painted Materials
- Zirconia
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WAFER CHUCKS MADE FROM SILICON CARBIDE are no challenge for the Photo-Machining Process. These Chucks are used most commonly for silicon wafer processing and inspection. The "before" and "after" photos below illustrate the capability, precision and uniformity of the Process. Individual posts/wafer supports can be any shape (round, square, triangles, linear, etc.) ranging from 0.3µm in size and up. Typical machining depth control is 25µm to 50µm over a 300mm diameter area. These raised features are tapered so they are narrowest at their highest point and widest at the chuck base to maximize their strength.
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