Our photoresist technology coupled with abrasive etching is the basis for our Photoresist Machining Process (PMP). PMP is a photographic process, which gives the process a high level of precision and accuracy.

PMP is used to selectively remove material from a variety of hard and brittle surfaces. Layered or coated substrate surfaces can be modified, patterned or channeled to achieve the desired end product. A variety of surface finishes are possible. Typical depth uniformities possible are within 50 microns across a 30 cm length. [See figure 1]

PMP can remove material at a rate much faster than conventional machining methods, CNC, ultrasonic machining, etc.

The material removal rate will vary depending on the type and density of the substrate used.

PMP includes the following simple steps:

• Prepare Phototool
• Apply photoresist to surface of workpiece
• Register phototool on surface of workpiece
• Expose photoresist to ultraviolet light (see figure 2)
• Develop photoresist
• Etch (see figure 3)